Dow, Carbice Partner to Advance Thermal Interface MaterialsDow, Carbice Partner to Advance Thermal Interface Materials

Dow and Carbice, a pioneer in carbon nanotube (CNT) technology, have announced a strategic, first-of-its-kind partnership to provide a multi-generational thermal interface material (TIM) for high-performing electronics in the mobility, industrial, and consumer industries, as well as for semiconductors. The collaboration was unveiled at The Battery Show and Electric & Hybrid Vehicle Technology Expo held on Oct. 8 to 10 in Detroit. The event was organized by PlasticsToday publisher Informa Markets – Engineering.

Decades of silicone expertise meets cutting-edge CNC technology

The partnership combines Dow's decades-long legacy in silicones with Carbice's patented CNT technology to offer novel thermal management products. This collaboration will meet rising demand for reliability in the expanding thermal interface market with innovative pad solutions for e-mobility and electronics applications.

Dow’s MobilityScience commitment

“Heat poses a significant threat to electronics, which makes selecting the right TIM crucial in the design process,” said Dow’s Jeroen Bello, global senior marketing director for MobilityScience in the performance silicones space. “Partnering with Carbice enables us to enhance our service to customers by offering thermal management solutions through the combined use of liquid silicones and solid pads. This is a uniquely advantageous collaboration within the industry. We look forward to jointly setting new performance and reliability benchmarks for electronic applications.”

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Silicone and CNTs individually offer thermal management benefits, but together they offer even more. The exceptional wetting capabilities and precise dispensing of Dow silicones combined with the versatility and durability of Carbice CNTs create an interface contact that lowers all modes of stress transfer for reliable solutions, allowing them to operate in a range of environments. By leveraging Carbice’s CNT technical and modeling expertise with Dow’s material science knowledge, customers can utilize thermal management materials tailored to their applications with extremely thin bond lines to reduce interface stress.

Comprehensive modeling capabilities deliver more predictable outcomes

Collaboration from the initial design phase will allow customers to efficiently tap into comprehensive modeling capabilities, guaranteeing access to more predictable outcomes. This approach not only enables cost-effective design optimization, but it also allows more efficient manufacturing processes, especially in targeted applications. Additionally, ongoing joint R&D will support continuous delivery of novel liquid and solid thermal management technologies.

“Whether it's an EV battery or a GPU in a mobile device, electronics need to withstand a range of complex operating environments without overheating,” said Baratunde Cola, Carbice CEO and founder. “Our partnership with Dow allows us to combine our high-performance, easy-to-use thermal interface solutions with their silicone technologies to yield durable, tailored, and cost-effective [products] that can be relied on regardless of the temperature or moisture levels within their environment. This partnership reflects another stride in our mission to supply critical components to the world’s most important applications at scale, creating a world where solid pads you can trust function as the backbone of every electronics’ cooling system.”