Sponsored By
Stephen Moore

January 3, 2017

1 Min Read
New PPS grade approved for the laser direct structuring process

The resurgence of polyphenylene sulfide (PPS) resin on account of increased adoption in the auto sector as cars electrify and employ increasing numbers of sensors was noted as a key trend of 2016. Highlighting this inclination is the development by Japan’s DIC of what is reportedly the world’s first PPS compound that can be applied to the laser direct structuring (LDS) process for inscribing circuit patterns onto polymer substrates. The grade, LP-150-LDS, is on the approved list of German LDS equipment and technology provider LPKF Laser & Electronics.

Sensors employed in automobiles are a prime target for a new laser direct structuring PS grade from Japan’s DIC.

Prior to July last year, liquid crystal polymer (LCP), polyamide (PA), and polyetheretherketone (PEEK) were among the engineering plastics approved by LPKF for its LDS process. Several companies were also known to be working on PPS grades for approval but DIC is the first to be officially certified as a PPS grade supplier for the process. Currently, DIC is shipping samples of the compound, which incorporates an organic metal compound dispersed throughout the PPS matrix.

The LDS process is proving particularly popular with European automotive component and electronic device manufacturers. As such, DIC was in attendance at the recent K Show introducing LP-150-LDS to prospective end users through its affiliate DIC Europe GmbH.

About the Author(s)

Stephen Moore

Stephen has been with PlasticsToday and its preceding publications Modern Plastics and Injection Molding since 1992, throughout this time based in the Asia Pacific region, including stints in Japan, Australia, and his current location Singapore. His current beat focuses on automotive. Stephen is an avid folding bicycle rider, often taking his bike on overseas business trips, and is a proud dachshund owner.

Sign up for the PlasticsToday NewsFeed newsletter.

You May Also Like