New PPS grade approved for the laser direct structuring process

The resurgence of polyphenylene sulfide (PPS) resin on account of increased adoption in the auto sector as cars electrify and employ increasing numbers of sensors was noted as a key trend of 2016. Highlighting this inclination is the development by Japan’s DIC of what is reportedly the world’s first PPS compound that can be applied to the laser direct structuring (LDS) process for inscribing circuit patterns onto polymer substrates. The grade, LP-150-LDS, is on the approved list of German LDS equipment and technology provider LPKF Laser & Electronics.

Prior to July last year, liquid crystal polymer (LCP), polyamide (PA), and polyetheretherketone (PEEK) were among the engineering plastics approved by LPKF for its LDS process. Several companies were also known to be working on PPS grades for approval but DIC is the first to be officially certified as a PPS grade supplier for the process. Currently, DIC is shipping samples of the compound, which incorporates an organic metal compound dispersed throughout the PPS matrix.

The LDS process is proving particularly popular with European automotive component and electronic device manufacturers. As such, DIC was in attendance at the recent K Show introducing LP-150-LDS to prospective end users through its affiliate DIC Europe GmbH.