A newly developed film-type adhesive component quickly and durably bonds dissimilar materials, such as resins and metals. WelQuick, developed by Japan-based Showa Denko (SDK), eliminates the use of liquid components and shortens bonding time from several minutes to a few seconds. SDK has already started shipping samples of WelQuick to potential customers.
In recent years, composite structures have been introduced in components to meet demands for lightweighting, heat-resistance, and strength, typically requiring the bonding of dissimilar materials. While many methods exist for these bonding applications, they typically do not achieve the dual goals of simplicity and adhesive strength, said SDK.
WelQuick can bond resins, such as polycarbonate, polyethylene terephthalate, and nylon, with aluminum, iron, copper, and other metals. The adhesive achieves a shear adhesive strength greater than 10MPa with more than 40 combinations of base materials, according to SDK. WelQuick is compatible with a range of welding methods, including ultrasonic, electromagnetic induction, and heat welding. WelQuick film can be stored at room temperature for long periods, and it does not emit volatile organic compounds (VOCs) when welded.