Bridging the temperature gap between phenolic and polyimide resins, a benzoxazine thermoset has been introduced that operates effectively in the range of 375 to 450F. Hycomp 500 resin reportedly offers cost and processing advantages over bismaleimides (BMI), the product currently serving this specific temperature range.

This new resin comes in two forms: dry powder or aqueous dispersion. It melts at 230F and cures at 400F. Still in testing, the resin is said to be resistant to acids, bases, strong solvents, salt, water, and high humidity. When co-cured with an epoxy resin the best properties of the epoxy are retained, as well as reportedly faster cures and greater thermal stability. The resin can also be co-cured with phenolics and polyamines and is said to yield enhanced properties in both cases.

Applications are still evolving, but friction products such as composite bearings for automobiles and trains are targeted, as well as electric components. Patents are currently pending and prices are estimated at $15 to $18/lb.

Hycomp Inc.
Cleveland, OH
(440) 234-2002
www.hycompinc.com