Husky HyPET

Husky launches next-gen preform molding system

The HyPET HPP5e system features improvements in energy consumption, system reliability, preform quality and user friendliness.

Husky Injection Molding Systems (Bolton, ON, Canada) announced today the launch of its next-generation preform molding HyPET HPP5e system. The HyPET HPP5e system is the result of significant technology improvements related to energy consumption, system reliability, preform quality and user friendliness, said Husky.

“Husky originally launched the HyPET HPP5 system as the world’s most productive and fully integrated preform molding solution capable of delivering the most challenging preform applications, without compromising system performance, output or quality,” said Rob Domodossola, Husky’s President of Rigid Packaging. “We have now taken this industry-leading solution to the next level by implementing a number of significant technology improvements that work together to deliver a smarter, more-intuitive, more-productive system that will increase customer value and competitiveness on multiple levels.”

At the heart of the platform is an intelligent, adaptive technology that uses feedback from pressure and actuator sensors to determine the optimum pressure required to effectively and efficiently mold every application, Husky explained. This innovative smart system monitors and automatically adjusts for optimal energy consumption without impacting system capability, cycle time or part quality.

Some of the modifications that make the HyPET HPP5e more robust and reliable than previous iterations include a new conveyor technology that reduces preform bounce when parts are ejected from the CoolPik unit to the exiting conveyor; enhanced mold alignment software that supports faster system setup and troubleshooting; and new robot linear bearings to maximize longevity. Altanium Inside ICC cards also have been upgraded for more integrated, accurate temperature control and a new nozzle shut-off cylinder promotes component longevity.

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