Polyplastics Co. Ltd., a global supplier of engineering thermoplastics headquartered in Tokyo, has launched a series of low-dielectric liquid crystal polymers (LCPs) for next-generation communication devices. Laperos E420P is the first in a series of low-dielectric grades with inherent high-heat resistance, mechanical properties, chemical resistance, high flow and low warpage for films and connectors used in cabling, antennas and circuit boards.
Polyplastics developed the LCP series because of increasing demand for low dielectric materials to satisfy the needs of 5G and V2X telecommunications for autonomous automobiles and high-speed, high-frequency transmission components.
Laperos E420P uses a combination of filler and formulation technologies to achieve a low dielectric constant of less than 3.0 measured perpendicular to the flow direction for the 1 to 20 GHz frequency band. Further, the dielectric loss tangent is stable over the entire frequency band. The material also fulfills downsizing requirements and increasingly complex designs in connector applications. It can be used in surface mount technology (SMT) processes, added Polyplastics.
The company plans to extend its product portfolio to include grades with enhanced low warpage, higher heat resistance and greater flow for compact, fine-pitched connectors. Polyplastics reports that in tests using the company’s connector molds, the new grades are molded at lower packing pressure than conventional grades.