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Arburg has brought an array of machine solutions to Chinaplas in Shanghai, including injection molding presses configured for the fast growing packaging, medical technology and electronics sectors in China.In the electronics field, a polyamide-based thermoplastic injectable hotmelt adhesive from Henkel is being employed as an encapsulant for an LED circuit board and two connector cables, rendering the overmolded LED carrier waterproof. The vertical Allrounder 275 V used has a clamping force of 250 kN and size 100 injection unit.

April 22, 2014

3 Min Read
Chinaplas: Arburg highlights performance applications in packaging, electronics and medical

Arburg has brought an array of machine solutions to Chinaplas in Shanghai, including injection molding presses configured for the fast growing packaging, medical technology and electronics sectors in China.

In the electronics field, a polyamide-based thermoplastic injectable hotmelt adhesive from Henkel is being employed as an encapsulant for an LED circuit board and two connector cables, rendering the overmolded LED carrier waterproof. The vertical Allrounder 275 V used has a clamping force of 250 kN and size 100 injection unit.

ARBURG35401-01LEDHotmelt_lo_res.jpg

Hotmelt adhesive encapsulant makes LED carried waterproof.

The vertical press' screw that has been adapted to process the material has a diameter of 35 mm and the injection cylinder is equipped with a needle shut-off nozzle. With the 1+1-cavity mold used, the cycle time is around 110 seconds, which is ideal for a simultaneous manual insertion process. The molded part weighs 15.1 g.

In the first cavity, the circuit board with the entire electronics and an attached LED is manually inserted and the base is overmolded. The pre-molded part is then inserted into the second cavity and subsequently overmolded with the hotmelt adhesive to create the finished part.  The Hotmelt granulate is supplied via an attached 5-litre drying and dosage system from Motan-Colortronic.

Thermoplastic hotmelt adhesives can be used over a wide range of temperatures and feature excellent adhesion on polar plastics. This reportedly makes them highly suitable for overmolding sensitive electronic components, as found in the automotive sector for example. The low mold cavity pressures required for injection molding, due to the extremely low melting viscosity of the material, are a major advantage because the sensitive internal workings of the electronic components remain undamaged and are protected from environmental influences.

Henkel has developed thermoplastic hotmelt adhesives in its Macromelt product group that can be processed at temperatures between 180°C and 240°C. They are manufactured from sustainable raw materials, do not release any solvents and have a wide application temperature range of -40°C to 140°C. Their adhesion to PA, PBT, PVC and similar polar plastics is also reportedly excellent.

Packaging and medical highlights

An injection molding machine optimized for the "stringent demands of the packaging industry" is another item of equipment on show at the Arburg stand (E1G01). Four in-mold-labeled (IML) cups are being molded in a cycle time of only 2.75 seconds on the "Packaging" version of a hybrid Hidrive (electric injection/hydraulic clamping) Allrounder 570 H. The exhibit features a clamping force of 1,800 kN and a size 800 injection unit. The IML system is from French automation and in-mold labeling specialists Machines Pagès. The four-cavity mold from Swiss manufacturer Kebo was adapted for the high-speed production of thin-walled IML tubs, while the labels come from Belgian suppliers Verstraete.

In the medical segment, a hybrid Allrounder 570 H with a clamping force of 2,000 kN and a size 800 injection unit is molding syringe barrels in a 32-cavity mold from Schöttli in a cycle time of less than 6.5 seconds, corresponding to around 300 molded parts per minute or around 18,000 items per hour. The medical disposable has a part weight of 1.1 g.

3D printing next year at Chinaplas

Commenting on the release of the Freeformer 3D printer at the K Show last year in Germany, Helmut Heinson, Managing Director, Sales at Arburg reported minimal feedback and interest from processors in Asia, hence the decision not to bring the technology over to Chinaplas this year. "First we will launch the technology in Germany, then elsewhere in Europe, and then in the rest of the world," he noted. "We realize the importance of a close relationship with our first customers, hence the initial launch in Germany," he added. "But you can expect to see the Freeformer at Chinaplas 2015."

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