Dow Corning, a wholly owned subsidiary of The Dow Chemical Co. (Midland, MI) and a global supplier of silicones, silicon-based technology and innovation, will showcase its recently launched Dow Corning MB25-035 Masterbatch at the upcoming Applied Market Information (AMI) Multilayer Packaging Films Conference. This masterbatch technology is designed to reduce the coefficient of friction (COF) in high-speed form-fill-seal (FFS) packaging operations to optimize productivity and avoid costly interruptions. The FDA-compliant product was developed for use with low-density polyethylene (LDPE) blown film.
“Dow Corning MB25-035 Masterbatch solves key drawbacks of organic slip additives that can affect the entire FFS packaging process—from inaccurate dosing to die build-up, and from ra pid dissipation to negative impact on downstream operations,” says Christophe Paulo, global segment leader, Plastics Solutions, Dow Corning. “By replacing standard COF additives with this high-end technology, our packaging customers can achieve excellent slip performance over time while raising productivity and controlling costs. This new addition to our broad and expanding portfolio of high-value silicone additives offers a better option versus competitive products for film producers and converters, and brand owners that use multi-layer packaging films.”
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Dow Corning MB25-035 Masterbatch for LDPE blown film offers a superior alternative to organic additives, whose slip performance is known to degrade over time and at elevated temperatures. The product need only be incorporated into the outside layer of the film, unlike organics that are used in all layers. This saves money and prevents migration into package contents. Additionally, it prevents die build-up and gel deposition that can cause production interruptions and impact quality.
It will be the topic of a technical presentation by Dow Corning senior thermoplastic specialist, Ted Hays, on Tuesday, June 27 at 1:40PM CT. Hays will speak on this innovation in a technical presentation titled, “Next Generation Slip Additives for Low COF PE Films,” which will discuss in detail next-generation silicone-based additives for film that deliver longer-lasting, cost-effective slip performance than has been achieved to date. These additives also minimize impact on physical properties and haze. The product will also be featured in the Dow Corning booth (#14) along with the company’s complete line of advanced silicone-based additives for film processing and conversion.
The AMI Multilayer Packaging Films Conference will be held in Chicago June 27-28, 2017. Dow Corning technical experts will be on hand for the duration of the conference to answer questions and discuss the company’s portfolio of silicone additives for film applications.