If you’re looking for a comprehensive conference on all things “in-mold,” you might want to check out AWA Alexander Watson Associates’ IMLCON, IMDCON & IMECON. Three separate tracks are offered in one overarching conference that provides attendees with all they need to know about in-mold labeling (packaging), in-mold decorating (durable goods) and, the latest in-mold technology, in-mold electronics.
The 2019 conference will take place on Sept. 5 and 6 at the Hyatt Rosemont Hotel, located just 10 minutes from Chicago O’Hare international airport. The theme is Collaboration, Sustainability and New Technologies, and it will feature three distinct tracks detailing relevant technologies, markets and applications. The conference will also include industry updates and technology developments for the global in-mold technologies industry.
For more conference information and to register to attend, go to the AWA website.