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Purging compound targets medical, food application injection molding

Moulds Plus International has launched a new chemical purging compound based on a modified version of its High-E low-residuals product that specifically targets food and medical application injection molders. Ultra Purge 5060 was officially introduced earlier this year after undergoing 6 months of beta testing at three key customer sites, according to Graziano Pestarino, owner of Moulds Plus International U.S.A. (Orange County, CA).

Moulds Plus International has launched a new chemical purging compound based on a modified version of its High-E low-residuals product that specifically targets food and medical application injection molders. Ultra Purge 5060 was officially introduced earlier this year after undergoing 6 months of beta testing at three key customer sites, according to Graziano Pestarino, owner of Moulds Plus International U.S.A. (Orange County, CA).

Pestarino told PlasticsToday that the modified version of its existing High-E product, introduced as Ultra Purge 5060, features an antioxidant and a proprietary material that helps to soften carbon deposits on screws and in barrels and hot runner nozzles, so that the purging compound can remove them and prevent contamination of new parts.

Ultra Purge 5060 is food-contact certified to European and U.S. (FDA) standards and is a low residue solution so that molders don't have to be concerned with left over purging compound contaminating new parts. Within the U.S. market, Pestarino said that Ultra Purge 5060 will be produced at the company's California manufacturing facility.

Pestarino said Moulds Plus decided to launch Ultra Purge 5060 after the successful customer trials. Those were undertaken at two medical molders, and one automotive molding site. The medical suppliers were injection molding IV connectors from clarified ABS and surgical components from polycarbonate, while the automotive customer injection molded lenses in PC and acrylic.

Grade

Description

Operating Temp.

Purged Resin

For Use With

5060

Low residue chemical/mechanical purging compound designed for removal of carbon deposits

374ºF - 608ºF (190ºC - 320ºC)

ABS, PA, PS, PC, PBT, GPPS, HIPS, PMMA, PET, SAN

Injection Molding, Hot Runners, Extruders and Blow Molding without accumulators

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