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SABIC and LPKF pair for laser-structured electronics

LPKF’s Laser Direct Structuring (LDS) technology will be paired with specialized SABIC Innovative Plastics materials, allowing the integration of electronic and mechanical functionality in a single module, so that electronics OEMs can save space, while reducing manufacturing costs and development lead time. The technology uses a laser to sculpt a 3D structure on molded plastics in preparation for metallization, eliminating printed circuit boards, harnesses, and metal inserts, which take up space.

LPKF’s Laser Direct Structuring (LDS) technology will be paired with specialized SABIC Innovative Plastics materials, allowing the integration of electronic and mechanical functionality in a single module, so that electronics OEMs can save space, while reducing manufacturing costs and development lead time. The technology uses a laser to sculpt a 3D structure on molded plastics in preparation for metallization, eliminating printed circuit boards, harnesses, and metal inserts, which take up space. SABIC says its engineering thermoplastics portfolio is suited for the process, since it requires plastics that can be metallized.

To meet that requirement, SABIC Innovative Plastics has developed LDS-enabled compounds through its LNP division based on polyphthalamide (PPA), polyphenylene oxide (PPO), nylon, and polycarbonate/acrylonitrile butadiene styrene (PC/ABS).

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