German companies LPKF, specialized in micromaterial processing with laser structuring, and plasma treatment and coating expert Plasma Innovations GmbH have developed a novel process for manufacturing LED functional heat sink printed circuit board assemblies based on molded interconnect device technology and using Therma-Tech material from PolyOne. They showcased the technology at Fakuma 2014 in Friedrichshafen, Germany.
Until now in LED lighting assemblies, the challenge has been the need for a heat sink to transfer heat away from LEDs, coupled with a printed circuit board for mounted LEDs. This has generally been addressed by using an aluminum body instead of a plastic one, assembled with a thermal dielectric layer and an LED printed circuit board module. If using a plastic body, a galvanic reinforcement step is added to the manufacturing process.
PolyOne’s Therma-Tech material, which is thermally conductive and can also be formulated for electro-conductivity, may eliminate the need for a metal heat sink and help cut out a number of steps in the manufacturing process, as the circuit tracks for the copper wiring can be placed directly on the plastic body.
According to Malte Mussman of Plasma Innovations, “It’s a revolution. No galvanic reinforcement. No printed circuit board. And it’s 3D, which means huge design freedom for new lamp designs.”
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