Dynaloy Inc. originally specialized in cleaning solvents to remove things like potting and encapsulating compounds from electronics. The company realized, however, that many of the solvents being used for that purpose were also suitable for cleaning molds and thus started targeting the molding industry. Now, it has compiled a 13-product Mold Cleaning Solvent line, comprised of cleaners to strip epoxy, urethane, acrylic, silicone, and other material residues, as well as remove mold release compounds. Three of the solvents in this line are new and designed specifically for molds.
Hydrocarbon-based Dynasolve 218 is designed for removal of silicone molding compounds and wax-based mold releases. Amino ethanol based Dynasolve 2000 works on a variety of polymers, urethanes, epoxies, and rubbers and can remove burnt-on material on molds when heated. And cyclic acid based Dynasolve CU-9 is formulated for the removal of urethane mold residue combined with layers of silicone mold release buildup. It can also be used for extended periods and can tolerate high resin loadings.
All of the solvents in the line are designed to replace hazardous or heavily regulated solvents, such as methylene chloride, in mold cleaning operations. Solvents can also be developed to suit individual needs. The three new solvents range from $29/gal for a 55-gal drum to $35/gal for a 5-gal pail. Pint, quart, bottle, and case quantities are also available. A 1-pt container costs $30.
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