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Thermoformed, inmold labeled, and coming to the U.S.

Rigid plastics packaging processor Tech II will be the first in the U.S.—and only the second in the world—to use inmold labeling in decoration of a commercial thermoformed part. According to the supplier of the automation system, Hekuma, the demand for this technology is set to escalate.

Matt Defosse

June 18, 2010

2 Min Read
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Rigid plastics packaging processor Tech II will be the first in the U.S.—and only the second in the world—to use inmold labeling in decoration of a commercial thermoformed part. According to the supplier of the automation system, Hekuma, the demand for this technology is set to escalate. 

Inmold labeling (IML) ensures a label will not slide, crimp or otherwise be damaged. Typically, a label is inserted into a mold or tool, and then heated or molten plastic is injected or otherwise introduced to the mold behind it; the plastic cools and a permanent bond is formed with the label. In Europe and some parts of Asia, IML has taken off, especially in injection molded packaging applications, whereas in North America the vast majority of IML applications have been on blowmolded packaging. Increasingly the technology also is being considered for durable goods such as car parts or medical devices that require a label durable for the life of the product.

But while injection molding and blowmolding have become established IML opportunities, to now thermoformed IML products have been difficult to find outside of the occasional line running during a machine maker's open house, such as during this event at Illig last year. A commercial line started up last year at a German processor, Bartling GmbH, which is using machinery supplied by Italy's OMV to thermoform and inmold label PP food containers. More on that project can be found in our article. Another commercial line in Austria is using Illig machinery. 

Bernhard Rupke, CEO at automation systems supplier Hekuma (Eching, Germany), said he too knows of only this sole IML-thermoforming system in commercial operation, but says interest in the thermoforming community is rapidly gathering speed. During the upcoming K 2010 tradeshow, his company and thermoforming machine manufacturer TSL-Thermoforming Systems LLC will display the line that, following the show, will be shipped to packaging injection molder and printer Tech II (Springfield, OH) for processing of a packaging application. The system will have a 14-cavity tool.

Rupke spoke during a pre-K 2010 press event in Düsseldorf, Germany. He said that he anticipates IML finding greater use in thermoforming applications, as it also offers processors and their customers the ability to directly and permanently integrate barcodes or RFID transponders onto parts. —Matt Defosse

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