Use less purging compound

Intended for applications that use clear or soft resin, Asaclean?Sun Plastech Inc.?s (Parsippany, NJ) E grade purging compound has been improved so that less of the compound (up to 20%) is needed during a purge. Residue formation is also decreased by up to 25%, according to Asaclean. Operating temperatures remain the same as with the previous version?160-270°C.?AC