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Medical-Grade Adhesive Bonds COC/COP Substrates and Other Difficult-to-Bond Plastics

The MD 1172-M-UR adhesive is formulated with Dymax Corp.’s Ultra-Red fluorescing technology, facilitating visual post-cure quality inspections.

PlasticsToday Staff

November 13, 2020

1 Min Read
lab on chip device
The adhesive is formulated with Dymax's Ultra-Red fluorescing technology to accelerate quality inspections.Image: Dymax

A light-curable adhesive for bonding COC/COP film laminates and other difficult-to-bond plastics has been introduced by Dymax Corp. It is suited for the assembly of in vitro diagnostic products, lab-on-chip assemblies, and other point-of-care medical devices.

The LED UV and broad-spectrum light-curable adhesive, MD 1172-M-UR, is moisture resistant, soft, and flexible. It has a durometer of A70 and viscosity of 1,100 cP for improved wetting, said Dymax. 

MD 1172-M-UR is formulated with the company’s Ultra-Red fluorescing technology, facilitating visual post-cure quality inspection of the bond line area. When exposed to low-intensity black light (365 nm) after cure, the material fluoresces bright red, making it easy to see on plastics, such as PVC, that naturally fluoresce blue in color, said Dymax.

The adhesive has undergone cytoxocity testing in accordance with ISO 10993-5. Possible applications include rapid diagnostic kits, microfluidic components, reservoir and transducer assemblies, and medical potting.

The adhesive cures in seconds upon exposure to LED UV or broad-spectrum light energy. To achieve the full potential of accelerated cure time, Dymax recommends using its LED light-curing system. The product provides users with significant advantages over conventional lamp-curing systems, including cooler curing temperatures, more consistent cure results, and lower intensity degradation over time, said Dymax.

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