Partnership pursues 3D-MID applications

The Val Tech Group (Rochester, NY), which has been expanding its cleanroom space, is partnering with SelectConnect Technologies (Palatine, IL)  to produce three-dimensional molded interconnect device (3D-MID) components.

"MID allows designers in the medical marketplace to integrate complex electrical and mechanical features into

applications which would be difficult or impossible using the existing flat 2D technologies," James Andolina, director of business development at Val Tech told PlasticsToday.com.

SelectConnect Technologies uses laser direct structuring and electroless metallization to create metallic circuits and traces on 3D molded thermoplastic components that are used for a wide range of electro-mechanical applications that include sensor packaging, 3D conformal antennas, 3D circuits, active security shields and 3D-MID.

SelectConnect Technologies President, Richard Macary says: "Partnering with The Val Tech Group leverages our respective technologies to deliver complete, cost effective solutions that address the need of making electronics smaller, lighter, higher performing at reduced costs."

Val Tech has experience in two-shot molding in which a non-plateable plastic is overmolded with a plateable-grade material forming antenna patterns or electronic circuitry. Andolina says that Val Tech has been producing multi-material, plastic injection molded parts for conductive plating applications since the introduction of the technology.

Several two-shot options

Val Tech currently has six two-shot molding machines in a variety of press sizes. Rotary platen, core back, lift-and-turn, and robotic transfer are all available two-shot options dependant on the specific part geometry.

SelectConnect Technologies has two LPKF laser systems to produce circuits on plastic and uses electroless plating processes to metallize thermoplastics.

Electroless metallization processes are used to produce EMI/RF shielding, EMP (electro-magnetic pulse) protection, grounding and conductivity on a wide range difficult to plate thermoplastics such as polyetherimide), acrylonitrile butadiene styrene (ABS), polycarbonates (PC), PC/ABS, polyamides, polybutylene terephthalate, polyethylene terephthalate, polyphenylene oxide, polysulphone, polyetherketone, polyetheretherketone, polyimides, polyphenylene sulfide, and polyoxymethylene.

Val Tech operates 44 molding machines ranging from 18 to 950 tons.  The company currently has four clean rooms and an in-house microbiology lab to support bioburden controlled clean rooms.  It also has high-speed automated assembly of medical devices in addition to some semi-automatic and manual assembly.

"I cannot share the specifics of the medical devices we are currently working on that utilize the MID technology due to confidentiality," says Andolina. 

Val Tech will also be using the 3D-MID technology in other markets.