Product News - Purging Compound Is For Single-Layer Film And Sheet ExtrudersProduct News - Purging Compound Is For Single-Layer Film And Sheet Extruders
August 1, 1999
Purging Compound Is For Single-Layer Film And Sheet Extruders
Dyna-Purge F is a specialty purging compound for cleaning single-layer film and sheet extruders at 320 to 420 F. The compound has a non-chemical additive that is said to improve cleaning power; when subjected to heat from the process, it expands and foams to reach all the gaps in the system and purge the resin.
The compound flows through the barrel, screen pack, dies and metering devices, scrubbing and cleansing the entire system, including downstream devices, so processors do not have to dismantle the machinery.
Shuman Plastics, Inc.
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