Chinaplas preview: Electronics thinnovation generates demand for high-heat resins

DSM Engineering Plastics (Sittard, the Netherlands) believes it has the perfect material to meet such challenges with its halogen-free, low warpage Stanyl for Tii polyamide and has found an early adopter in interconnect suppler Amphenol (Cedar Grove, NJ), which has selected the material in its Energy Edge Card connector. "Stanyl for Tii excels in mechanical strength and the material outperforms other high temperature polyamides or liquid crystal polymers in the wall breakage test," says Yuwen Chu, Senior Director of Engineering at Amphenol East Asia, Taiwan. "This is especially relevant since our customers are constantly updating their product specification to meet even more severe test conditions, requiring an even higher strength for thin(ner) walls. In UL94 flammability testing, Stanyl for Tii is the only polymer in this product family able to pass the stringent UL test."

The switch from the previous connector generation in LCP to Stanyl for Tii also allows Amphenol to carry a higher current per connector per pin, in line with the upcoming increase in product specification by leading server OEMs. Stanyl for Tii meets UL90 V-0 classification even down to 0.2-mm wall thickness. The material also enables a higher pin density for higher data rates.

DSM Engineering Plastics also offers Stanyl Cotton Rose PA 4T for connector applications. The semi-aromatic PA is halogen-free and UL V-0-rated, while it also exhibits low moisture absorption, making it suitable for use in high humidity environments. The high-heat resin has a melting point of 325°C.-[email protected]