Automated Gas Plasma System Modifies Polymer Surfaces
The new V170-G Microwave Gas Plasma System is designed for high-volume surface modification, which increases adhesion prior to bonding, printing, coating and painting. Unit features microwave/dual frequency, which is said to result in high throughput rates; a large, electrode-free chamber and microprocessor control.
The automated handling system can be customized to minimize operator involvement and accommodate specific production environments. Clean room versions and chamber sizes up to several hundred cubic feet are available. Please contact the company directly for pricing information (see the Key Contact Directory).